This is Huawei's first public confrontation since the United States issued a ban.
On July 6th, Shenzhen Jin Tuo Automation Equipment announced that it had signed a legally binding five-year cooperation memorandum with Huawei Hisilicon Technology Department, the largest chip developer in China. The two sides aim to increase cooperation in the field of semiconductor packaging equipment, solve bottleneck problems and realize independent control of the industry.
According to the Nikkei Asia report, Shenzhen Jin Tuo Automation Equipment said in a stock exchange document on Tuesday that Huawei is stepping up the establishment of a domestic chip packaging and testing supply chain due to US restrictions.
Shenzhen Jin Tuo Automation Equipment was established in Shenzhen in 2004. It is a well-known supplier of intelligent equipment system and advanced manufacturing system integrating R&D, production and sales in China. Mainly responsible for equipment manufacturing in consumer electronics, automotive electronics, aerospace, national defense science and technology production and other fields. Its main customers include Gree and Haier, the largest home appliance manufacturers in China, and Flextronics, an electronic assembler.
Since 2065438+May 2009, the United States has repeatedly strengthened export control over Huawei on the grounds of national security to prevent Huawei and its subsidiaries from acquiring American technology.
At present, chip production tools, chip design software and application materials are dominated by a few American companies. As part of the restrictions, the United States has prevented many suppliers from cooperating with Huawei, including TSMC and Riyueguang Technology, which are the world's largest contract chip manufacturers and the largest chip packaging and testing service providers.
This move by the United States has dealt a blow to the development of Huawei's core chips and flagship smartphone business. Although it is still the second largest mobile phone manufacturer in the world, Huawei's market share has plummeted from 18% in 2020 to 4% and 5438+0 in the first quarter of 2026.
But this did not discourage Huawei.
At present, Huawei Hisilicon is the largest chip developer in China, and its chips are used in a series of devices such as smart phones, laptops, servers, automobiles and televisions. The department is also the world's largest manufacturer of surveillance camera chips, providing products for Hikvision, the world's largest manufacturer of surveillance cameras. At present, Hikvision has also been blacklisted by Washington. The Kirin mobile processor designed by HiSilicon helps Huawei's smart phones successfully compete with Apple and Samsung Electronics.
China's beleaguered technology giants have not given up their semiconductor capabilities built in the past few decades. In less than two years, Huawei invested in more than 30 chip-related companies in China, and acquired 65,438+00 shares of domestic semiconductor-related companies in the first half of this year.
It has also increased its global recruitment efforts, especially in Europe, to recruit employees in the fields of semiconductors, artificial intelligence, software and autonomous driving technology.