Manufacturing technology and principle of chip

1. The raw wafer of the chip is silicon, which is extracted from quartz sand, and the wafer is purified silicon (99.999%). Then some pure silicon is made into silicon crystal rods, which become the materials for semiconductor manufacturing integrated circuits. Slicing them is a special wafer for chip manufacturing. The thinner the wafer, the lower the production cost, but the higher the requirements for the process.

2. Wafer coating Wafer coating can resist oxidation and high temperature, and its material is photoresist.

3. In the development and etching process of wafer lithography, chemicals sensitive to ultraviolet rays are used, that is, they will soften under ultraviolet irradiation. The shape of the chip can be obtained by controlling the position of the light shielding plate. Coating photoresist on silicon wafer to make it dissolve under ultraviolet radiation.

4. Doping impurities to implant ions into the wafer, thereby producing corresponding P and N semiconductors. Specifically, the process starts from the exposed area on the silicon wafer and is put into the mixed solution of chemical ions. This process will change the conduction mode of the doped region so that each transistor can be turned on, off or transmit data.

5. Wafer testing After the above process, lattice grains are formed on the wafer. The electrical characteristics of each grain are tested by pin test.

6. Packaging: The finished wafer is fixed, the pins are bound, and various packaging forms are made according to requirements, which is why the same chip core can have different packaging forms. Such as Big Dipper, QFP, PLCC, QFN, etc. This is mainly determined by external factors such as users' application habits, application environment and market form.

7. The last process of chip manufacturing is testing, which can be divided into general testing and special testing. The former is to test the electrical characteristics of the packaged chip in various environments, such as power consumption, operating speed, withstand voltage and so on.